Customize your EAGLE software with community-created programs.
copypaste allows you to copy a schematic and a corresponding board without loosing the placement of the elements on the board. You can copy a schematic and board from a newer version of EAGLE to an older version of EAGLE. The copy ULP creates one script for the schematic and one for the board that creates and places all elements of the source. These scripts are stored as clipboard_schematic.scr and clipboard_board.scr. The paste ULP combines the clipboard scripts, renames the elements with conflicting names, and stores the result as paste.scr. The paste script is then executed.
Crea una Matriz de leds muy fácilmente...tan solo hay que indicarle el numero de filas y columnas...y la separación entre los leds. Board con GRID de 0.01 inch\r\nUploaded by Emerson Ospino Urbano
Set of files to analyze a board and generate Gerber files and EXCELLON drill file. It will also prepare a ZIP of these suitable for delivery to a board fabrication house. Please see enclosed README. This zip file includes the correct drillcfg2.ulp, whereas the first upload did not.
Arrange 1.0 - arrange parts on board grouped by schematic page. Used with a multi-page schematic, this script will arrange the parts on the board into separate piles, one pile per schematic sheet. Use distribute.ulp to separate each pile.
Aligns board components in group or listed at the command line. This ulp can align components along a line parallel to the x or y axis of the board. The direction of alignment is autodetected by looking at the position of the components. The alignment direction can also be forced. This is an update. Added increment, alignment to reference object, force of direction and minor changes. Better documentation and more examples: Se Eagle Control Panel:User Language Programs:Align.ulp\r\nUploaded by Danny Damhave from Damhave Systems
Export GenCAD 1.4 file Format optimized for PCB-Investigator. The Export includes Signal Layers, Drill Layers, Solder Past Layers, Solder Mask Layers and Component Layers. www.PCB-Investigator.com
Latest version of via/pad teardrops fixed to work with Eagle v6 (thanks to Walter Muewa). The version also works on v5 as well. The teardrop pads feature has been modified to improve the pad teardrop fill.\r\nUploaded by Bob Starr from RTZ Audio
This ULP allows the elimination of double wires, stubs and other artifacts around vias and pads. It\'s very useful to eliminate teardrop artifacts on vias and pads created by other scripts.