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Customize your EAGLE software with community-created programs.
Ripup only polygons by signal name in visible layer Ripup nur von Polygonen des Signalnamen in sichtbaren Layern\r\nUploaded by A. Zaffran from CadSoft
Creates BGA packages with offset via\"s and trace between\r\nUploaded by Jim Thurman from NeuroCom Intl
Corrected rotatoin of RECTangle.\r\nUploaded by A. Zaffran from CadSoft
GENCAD V1.23 generates GENCAD placement data. Saves to dialog file name.\r\nUploaded by Jim Thurman from NeuroCom Intl
Teardrop Via Connections - Release: 1 - This ULP allows creation of teardrop-shaped connections from a board\"s vias to their attached wire segments. Making these connections teardrop shaped enhances manufacturability and reduces board failure by ensuring connectivity between the segment and via in cases where the via hole is not accurately drilled and would otherwise sever the segment.\r\nUploaded by Tad Artis from E3Switch LLC
Functions to draw line, place elements on circle/ellipse.\r\nUploaded by A. Zaffran from CadSoft
Generates packages for SMT.(CAE, CHP, MLD, QFP, SOD, SOIC, SOT)\r\nUploaded by Thorsten Mühlke from LISA laser products
Corrected numbering if use numerical order by sheet with same prefix.\r\nUploaded by A. Zaffran from CadSoft
Allows users to define the start and end angle for the circular array. Gives a little bit more flexibility.
added options to renumber by a combination of X a Y directions in various percentages