Customize your EAGLE software with community-created programs.
SNaP_BOM.ulp generates BOM output in CSV format that is optimized for RMC’s SNaP Product. SNaP is low cost, materials resource planning software, that was developed to assist engineering groups and small businesses in managing BOMs, technical datasheets, tracking material and labor costs, streamlining purchasing activity, scheduling builds, and managing inventory. For a free SNaP trial, visit www.rmc-inst.com
Interface for PCBSim, a simulation tool for signal integrity analysis developed by Felicitas Customized Engineering GmbH.
Distribute 1.0 - distribute grouped parts on board layout. After using arrange.ulp, parts will be arranged in piles on the layout. Select a pile and run this script to separate the parts to make it easier to manipulate each one. Can be used on any selected group of parts.
Arrange 1.0 - arrange parts on board grouped by schematic page. Used with a multi-page schematic, this script will arrange the parts on the board into separate piles, one pile per schematic sheet. Use distribute.ulp to separate each pile.
Set of files to analyze a board and generate Gerber files and EXCELLON drill file. It will also prepare a ZIP of these suitable for delivery to a board fabrication house. Please see enclosed README. This zip file includes the correct drillcfg2.ulp, whereas the first upload did not.
This ULP assumes the components to be arrayed are in the board or schematic prior to the ULP being run. Can handle both rectangular arrays and circular arrays.
Modified DXFImport v1.3 to permit applying a scale factor to the DXF data (and optionally the linewidth and origins).
shows a list of the smd and pads with the name, signal, type, position and layer.
Shows the partlist with all part info that can be used on schematics or board. On double-clic, the part is highlighted. If the schematics has several sheets, it will jump to the sheet of the selected part. Partlists can be saved from sch or brd.
shows a list of the signals with the name, number of associated wires, airwires, vias, mean position and length sum.