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Customize your EAGLE software with community-created programs.
Teardrop Via Connections - Release: 1 - This ULP allows creation of teardrop-shaped connections from a board\"s vias to their attached wire segments. Making these connections teardrop shaped enhances manufacturability and reduces board failure by ensuring connectivity between the segment and via in cases where the via hole is not accurately drilled and would otherwise sever the segment.\r\nUploaded by Tad Artis from E3Switch LLC
Teardrop PADS and VIAS! Improved support for teardropping of PADS to provide better fill with various pad sizes. Not perfect, but should give fairly usable results now.\r\nUploaded by Bob Starr from RTZ Audio
This ulp was modified from via-teardrops1.ulp written by Tad Artis originally. Limited support was added to allow teardrops for throughole pads as well. \r\nUploaded by Bob Starr from RTZ Audio
Teardrop creation script Version 1.13. Improves teardrops for small wire/big via/pad. Correction of some glitches.
This ULP allows the elimination of double wires, stubs and other artifacts around vias and pads. It\'s very useful to eliminate teardrop artifacts on vias and pads created by other scripts.
Latest version of via/pad teardrops fixed to work with Eagle v6 (thanks to Walter Muewa). The version also works on v5 as well. The teardrop pads feature has been modified to improve the pad teardrop fill.\r\nUploaded by Bob Starr from RTZ Audio